What is the encapsulation molding process? Encapsulation molding process is a typically used process for encapsulating the chosen object in a composite material, like epoxy resin, and protect integrated circuitry, many tiny chips in your computer make use of it, or passive devices like resistors, inductors or capacitors. Encapsulation molding process is very popular in the semiconductor industry because of its ease at molding a robust array of inventions both tiny and large.

Integrated circuitry makes use of the encapsulation molding process by protecting it from dirt and debris as well as moisture. If you did not know, circuitry does not exactly play well with water. The story is the same for passive devices like resistors, capacitors and inductors. Each device needs a varying degree of encapsulated molding. For example, what do all the aforementioned passive devices have in common? They are all electrical components utilizing electrical powers for different results whether its a magnetic field like inductors, or the electrical resistance used in resistors or the stored electrical energy within capacitors.

One can easily confuse reaction injection molding, alternatively known by its acronym RIM, with injection molding. They would not be entirely wrong, either. However, the defining difference between injection molding and reaction injection molding is RIM uses thermosetting polymers. When the thermosetting polymers are inside the mold, a curing reaction needs to take place for the polymers to be of use. Curing, in this case, is a fancy term for hardening, or to toughen.

Reaction injection molding has also received good publicity for its relative ease for artistic expression. Reaction injection molding allows for a wide array of wall thickness other processes might have a harder time achieving.

Reaction injection molding also offers efficient turn out rates for its cost. If you are testing a product, reaction injection molding could give you the varying degrees of volume you will need without sending your wallet into panic mode. This also goes for tooling costs. Reaction injection molding can offer one piece solutions that cut the total of parts and thereby, saving yourself some time assembling the project.

The encapsulation molding process continues to be popular for its varied applications and results, not only for the final product but for testing phases as well. Its cost for volume efficiency can even allow for wiggle room in production costs without sacrificing artistic expression.